Thermal component temperature management system and method

ABSTRACT

A system for managing the temperature of a thermal component. The system comprises a heat exchanger in thermal contact with the thermal component. The temperature management system also comprises a heat storing temperature management system for removing heat from the thermal component and storing the removed heat within the heat storing temperature management system. The temperature management system further comprises a heat exhausting temperature management system for removing heat from the thermal component and transferring the removed heat to the environment outside the temperature management system.

CROSS-REFERENCE TO RELATED APPLICATIONS

Not Applicable.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

Not Applicable.

BACKGROUND OF THE INVENTION

To drill a well, a drill bit bores thousands of feet into the crust ofthe earth. The drill bit typically extends downward from a drillingplatform on a string of pipe, commonly referred to as a “drill string.”The drill string may be jointed pipe or coiled tubing, through whichdrilling fluid is pumped to cool and lubricate the bit and lift thedrill cuttings to the surface. At the lower, or distal, end of the drillstring is a bottom hole assembly (BHA), which includes, among othercomponents, the drill bit.

In order to obtain measurements and information from the downholeenvironment while drilling, the BHA includes electronic instrumentation.Various tools on the drill string, such as logging-while-drilling (LWD)tools and measurement-while-drilling (MWD) tools incorporate theinstrumentation. Such tools on the drill string contain variouselectronic components incorporated as part of the BHA. These electroniccomponents generally consist of computer chips, circuit boards,processors, data storage, power converters, and the like.

Downhole tools must be able to operate near the surface of the earth aswell as many thousands of feet below the surface. Environmentaltemperatures tend to increase with depth during the drilling of thewell. As the depth increases, the tools are subjected to a severeoperating environment. For example, downhole temperatures are generallyhigh and may even exceed 200° C. In addition, pressures may exceed20,000 psi. There is also vibration and shock stress associated withoperating in the downhole environment, particularly during drillingoperations.

The electronic components in the downhole tools also internally generateheat. For example, a typical wireline tool may dissipate over 100 wattsof power, and a typical downhole tool on a drill string may dissipateover 10 watts of power. While performing drilling operations, the toolson the drill string typically remain in the downhole environment forperiods of several weeks. In other downhole applications, drill stringelectronics may remain downhole for as short as several hours to as longas one year. For example, to obtain downhole measurements, tools arelowered into the well on a wireline or a cable. These tools are commonlyreferred to as “wireline tools.” However, unlike in drillingapplications, wireline tools generally remain in the downholeenvironment for less than twenty-four hours.

A problem with downhole tools is that when downhole temperatures exceedthe temperature of the electronic components, the heat cannot dissipateinto the environment. The heat may accumulate internally within theelectronic components and this may result in a degradation of theoperating characteristics of the component or may result in a failure.Thus, two general heat sources must be accounted for in downhole tools,the heat incident from the surrounding downhole environment and the heatgenerated by the tool components, e.g., the tool's electronicscomponents.

While the temperatures of the downhole environment may exceed 200° C.,the electronic components are typically rated to operate at no more than125° C. Thus, exposure of the tool to elevated temperatures of thedownhole environment and the heat dissipated by the components mayresult in the degradation of the thermal failure of those components.Generally, thermally induced failure has at least two modes. First, thethermal stress on the components degrades their useful lifetime. Second,at some temperature, the electronics may fail and the components maystop operating. Thermal failure may result in cost not only due to thereplacement costs of the failed electronic components, but also becauseelectronic component failure interrupts downhole activities. Trips intothe borehole also use costly rig time.

In general, there are at least two methods for managing the temperatureof thermal components in a downhole tool. One method is a heat storingtemperature management system. Heat storing temperature managementinvolves removing heat from the thermal component and storing the heatin another element of the heat storing temperature management system,such as a heat sink. Another method is a heat exhausting temperaturemanagement system. Heat exhausting temperature management involvesremoving heat from the thermal component and transferring the heat tothe environment outside the heat exhausting temperature managementsystem. The heat may be transferred to the drill string or to thedrilling fluid inside or outside the drill string.

A traditional method of managing the temperature of thermal componentsin a downhole tool using a heat exhausting system involves modestenvironmental temperatures such that the electronics operate at atemperature above the environmental temperature. In modest environments,the electronics may be thermally connected to the tool housing. Thethermal connection allows the heat to dissipate to the environment bythe natural heat transfer of conduction, convection, and/or radiation.This approach is limited by the temperature gradient between theelectronics and the environment.

A traditional method of managing the temperature of thermal componentsin a downhole tool using a heat storage system in harsh thermalenvironments is to place the electronics on a chassis in an insulatedvacuum flask. The vacuum flask acts as a thermal barrier to retard heattransfer from the downhole environment to the electronics. However,thermal flasks are heat storage systems that only slow the harmfuleffects of thermal failure. Because of the extended periods downhole inboth wireline and drilling operations, insulated flasks may not providesufficient thermal management for the electronic components for extendedperiods. Specifically, the flask does not remove the heat generatedinternally by the electronic components. A thermal mass, such as aeutectic material, can be included in the flask to absorb heat from thedownhole environment as well as the heat generated internally by theelectronics. However, both the thermal flask and the thermal mass areonly used to thermally manage the temperature of the interior of theelectronics compartment. Because the discrete components may internallygenerate heat, they may remain at a higher temperature than the averagetemperature of the interior of the electronics compartment. Thus,although the average temperature of the interior of the compartment mayremain at a desired level, discrete components may exceed their desiredoperating temperatures.

Another temperature management method for downhole electronics proposesa vapor compression temperature management system using water or othersuitable liquid; e.g., FREON®. In this method, liquid in one tank isthermally coupled with the electronics chassis of the downhole tool. Theliquid absorbs heat via the heat exchanger from the downhole environmentand the electronics, where the electronics are isolated from the liquid,and begins to vaporize. For example, water would begin to vaporize at100° C. so long as the pressure of the tank is maintained at 1.01×10⁵ Pa(14.7 psi). To maintain the pressure, the steam is removed from the tankand compressed and stored in a second tank, which is at or near thetemperature of the downhole environment. However, sufficient steam mustbe removed from the first tank with a compressor to maintain thepressure at 1.01×10⁵ Pa. Otherwise, the boiling point of the liquid willrise and thus raise the temperature of the electronics chassis in thefirst tank.

In practice, vaporization temperature management has significantproblems. First, a compressor must be supplied that is able to compressthe vapor to a pressure greater than the saturation pressure of thevapor at the temperature of the downhole environment; e.g., 1.55×10⁶ Pa(225 psi) at 200° C. for water. Second, the method does not isolate thethermal components but instead attempts to cool the entire electronicsregion. While the average temperature of the region may remain at 100°C., the temperature of the discrete electronic components may be higherbecause they may internally generate heat. Additionally, due to thetypically low efficiency of most temperature management systems and thetypically relatively high amount of heat to be extracted, substantialpower may be required by the system. This power is typically providedfrom downhole power generation devices such as turbine alternators.However, the downhole power generation devices are typically powered bydrilling fluid being pumped through the inside of the drill stringduring drilling. At times during the drilling process, the pumping maybe stopped to perform various tasks such as adding pipe to or removingpipe from the drill string. When the pumping is stopped, the downholepower generation devices are unable to supply power to the heatexhausting temperature management system. Thus, although temperaturemanagement is still required, those heat exhausting temperaturemanagement systems that require a source of power are unable to cool thethermal components when pumping is stopped because of the loss of power.Even if batteries are provided downhole, they are limited in theduration for which they can provide power to the heat exhaustingtemperature management system.

Another temperature management method proposes a sorbent temperaturemanagement system. This method again uses the evaporation of a liquidthat is thermally connected via heat exchanger with the thermalcomponents to manage the temperature of the components. Instead of usinga compressor to remove the vapor, this method uses desiccants in asecond tank to absorb the vapor as it evaporates in a first tank, thusproviding heat storage while requiring no input power. However, thedesiccants must absorb sufficient vapor in order to maintain a constantpressure in the first tank. Otherwise, the boiling point of the liquidwill rise as the pressure in the lower tank rises.

However, prior sorbent temperature management systems manage thetemperature of the entire electronics region, not the discrete thermalcomponents. Thus, because of internal heat generation, the thermalcomponents may remain at a higher temperature than the averagetemperature of the entire thermal component region. Second, thedesiccants must absorb sufficient vapor in order to maintain a constantpressure in the first tank. Otherwise, the liquid will evaporate at ahigher temperature and thus the temperature in the first tank willincrease. Further, the amount of water in the first tank limits thesystem. Once all the water evaporates, the system no longer functions.

Another heat exhausting temperature management method involves adownhole thermoelectric refrigeration system comprising a cold heatexchanger and a hot heat exchanger thermally coupled by semiconductormaterials. With the thermoelectric refrigeration system, the cold heatexchanger of the temperature management system is thermally coupled withthe thermal components.

Due to the typically low efficiency of thermoelectric refrigerationtemperature management systems and the typically relatively high amountof heat to be extracted, substantial power is required by thetemperature management system. This power can typically only be providedfrom downhole power generation devices such as turbines and alternators.However, the downhole power generation devices are typically powered bydrilling fluid being pumped through the inside of the drill stringduring drilling. At times during the drilling process, the pumping isstopped to perform various tasks such as adding pipe to or removing pipefrom the drill string. When the pumping is stopped, the downhole powergeneration devices are unable to supply power to the heat exhaustingtemperature management system. Thus, although temperature management isstill required, the thermoelectric refrigeration systems are unable tocool the thermal components when pumping is stopped because of the lossof power. Even if batteries are provided downhole, they are limited inthe duration for which they can provide power to the thermoelectricrefrigeration system.

Another temperature management method involves a downhole thermoacoustictemperature management system. An example of a downhole thermoacoustictemperature management system is described in U.S. Pat. No. 5,165,243,issued Nov. 24, 1992 and entitled “Compact Acoustic Refrigerator”,hereby incorporated herein by reference for all purposes. The compactacoustic refrigeration system cools components, e.g., electricalcircuits, in a downhole environment. The system includes an acousticengine that includes first thermodynamic elements for generating astanding acoustic wave in a selected medium. The system also includes anacoustic refrigerator that includes second thermodynamic elementslocated in the standing wave for generating a relatively coldtemperature at a first end of the second thermodynamic elements and arelatively hot temperature at a second end of the second thermodynamicelements. A resonator volume cooperates with the first and secondthermodynamic elements to support the standing wave. To accommodate thehigh heat fluxes required for heat transfer to/from the first and secondthermodynamic elements, first heat pipes transfer heat from the heatload to the second thermodynamic elements and second heat pipes transferheat from the first and second thermodynamic elements to the downholeenvironment.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more detailed description of the embodiments, reference will nowbe made to the following accompanying drawings:

FIG. 1 is a schematic view illustrating a temperature management systemaccording to a first embodiment;

FIG. 2 is a schematic view of a thermoelectric cooler optionally used inthe temperature management system of FIG. 1;

FIG. 3 is a flow chart representing a control system for the heatexhausting temperature management system of the temperature managementsystem of FIG. 1;

FIG. 4 is a schematic view illustrating a second embodiment temperaturemanagement system;

FIG. 5 is a schematic view illustrating a third embodiment temperaturemanagement system; and

FIG. 6 is a schematic view illustrating a fourth embodiment temperaturemanagement system.

DETAILED DESCRIPTION OF THE EMBODIMENTS

The present invention relates to a thermal component temperaturemanagement system and includes embodiments of different forms. Thedrawings and the description below disclose specific embodiments withthe understanding that the embodiments are to be considered anexemplification of the principles of the invention, and are not intendedto limit the invention to that illustrated and described. Further, it isto be fully recognized that the different teachings of the embodimentsdiscussed below may be employed separately or in any suitablecombination to produce desired results. The term “couple”, “couples”, or“thermally coupled” as used herein is intended to mean either anindirect or a direct connection. Thus, if a first device couples to asecond device, that connection may be through a direct connection; e.g.,via conduction through one or more devices, or through an indirectconnection; e.g., via convection or radiation. The term “temperaturemanagement” as used herein is intended to mean the overall management oftemperature, including maintaining, increasing, or decreasingtemperature and is not meant to be limited to only decreasingtemperature.

First Embodiment

FIG. 1 illustrates a first embodiment of a temperature management system10 disposed in a downhole tool 14 such as on a drill string 16 fordrilling a borehole 13 in a formation 17. The temperature managementsystem 10 might also be used in a downhole wireline tool, a permanentlyinstalled downhole tool, or a temporary well testing tool. Downhole, theambient temperature may sometimes exceed 200° C. However, thetemperature management system 10 may also be used in other situationsand applications where the surrounding environment ambient temperatureis either greater than or less than that of the thermal components beingcooled.

The temperature management system 10 manages the temperature of at leastone thermal component 12 that may, e.g., be mounted on at least oneboard 18 in the downhole tool 14. The thermal component 12 comprises,but is not limited to, heat-dissipating components, heat-generatingcomponents, and/or heat-sensitive components. An example of a thermalcomponent 12 may be an integrated circuit, e.g., a computer chip, orother electrical or mechanical device that is heat-sensitive or whoseperformance is deteriorated by high temperature operation, or thatgenerates heat. The board 18 is in turn mounted on a chassis (notillustrated) and installed within a cavity 15 of the downhole tool 14.

Heat Exchanger

The temperature management system 10 further comprises a heat exchanger20 thermally coupled with the thermal component 12. In one embodiment,the heat exchanger 20 is thermally coupled via a conductive path to thethermal component 12. However, in other embodiments, the heat exchanger20 may be thermally coupled with the thermal component 12 by radiationor convection. The heat exchanger 20 may be any appropriate type of heatexchanger, such as a conduction heat exchanger that uses heat conductionto transfer the heat through solids. The heat exchanger 20 may alsocomprise multiple layers of different materials, e.g., copper flow tubeswith aluminum fins or plates. The heat exchanger 20 may also be amicro-capillary heat exchanger. The micro-capillary heat exchanger mayalso be a micro-channel, cold plate heat exchanger with stacked platesenclosed in a housing. The heat exchanger may also be a liquid coldplate heat exchanger.

Heat Storing Temperature Management System

The temperature management system 10 further comprises a heat storingtemperature management system 11 thermally coupled with the heatexchanger 20. The heat storing temperature management system 11 removesheat from the thermal component 12 through the heat exchanger 20 andstores the removed heat in within the heat storing temperaturemanagement system 11. The heat storing temperature management system 11comprises a heat sink 22 comprising a phase change material for storingthe removed heat. The phase change material is designed to takeadvantage of the heat absorbed during the phase change at certaintemperature ranges; e.g., a eutectic material. Eutectic material is analloy having a component composition designed to achieve a desiredmelting point for the material. The desired melting point takesadvantage of latent heat of fusion to absorb energy. Latent heat is theenergy absorbed by the material as it changes phase from solid intoliquid. Thus, when the material changes its physical state, it absorbsenergy without a change in the temperature of the material. Therefore,additional heat will only change the phase of the material, not itstemperature. To take advantage of the latent heat of fusion, theeutectic material may have a melting point below the desired maintenancetemperature of the thermal component 12. The heat sink 22 may alsocomprise other types of thermal mass, such as copper, to store removedheat.

The heat sink 22 may be stored in a jacket 24 capable of withstandingdownhole temperatures and shock conditions. For example, the jacket 24can be a stainless steel container. Because the heat sink 22 may undergoa phase change, the jacket 24 may also be capable of withstanding thecontraction and/or expansion of the heat sink 22.

Thermal Conduit System

The heat storing temperature management system 11 also comprises athermal conduit system 26 for thermally coupling the heat exchanger 20and the heat sink 22. The temperature gradient between thermal component12 and the heat sink 22 is such that the heat sink 22 absorbs the heatfrom the thermal component 12 through the heat exchanger 20 and thethermal conduit system 26. The thermal conduit system 26 comprises athermally conductive material for transferring heat from the heatexchanger 20 to the heat sink 22. The thermal conduit system 26 mayalternatively comprise a coolant fluid conduit system that transfers theremoved heat using a coolant fluid in a closed-loop or an open-loopsystem. The coolant fluid is thermally coupled to the heat exchanger 20and the heat sink 22 and transfers heat absorbed from the heat exchanger20 to the heat sink 22, returning the coolant fluid to a lowertemperature. The thermal conduit system 26 maintains the coolant fluidseparate from the heat sink 22 material. The path of the thermal conduitsystem 26 through the heat sink 22 may be straight or tortuous dependingon the performance specifications of the temperature management system10. For example, the thermal conduit system 26 may flow helically intothe heat sink 22, reverse, and then flow helically out of the heat sink22. The thermal conduit system 26 may also transfer heat to the heatsink 22 using any other suitable means. The fluid may be moved withinthe thermal conduit system 26 using a fluid transfer device, e.g., afluid pump. Alternatively, the fluid in the thermal conduit system 26flows via convection, i.e., by maintaining a temperature differentialbetween any two-points in the system. The thermal component 12 may beimmersed in fluid, e.g., water or a fluorinated organic compound, e.g.,FLUORINERT®, or any other thermally conductive fluid. The fluid thethermal component 12 is immersed in need not be the same fluid as thecoolant fluid in the thermal conduit system 26. For example, the thermalcomponent 12 may be immersed in silicone oil or any other suitablefluid. Additionally, the thermal component 12 may be immersed in a fluidregardless of whether the thermal conduit system 26 is a fluid thermalconduit system. The fluid thermal conduit system 26 may be asingle-phase or multiple-phase system. Examples of thermal conduitsystems are discussed in U.S. patent application Ser. No. 10/602,236,filed Jun. 24, 2003 and entitled “Method and Apparatus for Managing theTemperature of Thermal Components”, hereby incorporated herein byreference for all purposes. Alternatively, the thermal conduit systemmay thermally couple more than one thermal component 12 to the heat sink22. Also alternatively, the heat removed from the thermal component 12may be absorbed directly by the heat sink 22; e.g., via conduction bybeing in contact with the heat exchanger, or via convection or radiationfrom the heat exchanger to the heat sink.

Thus, with the exception of the alternatives requiring a fluid transferdevice, the heat storing temperature management system 11 requires nopower to remove heat from the thermal component 12. Even with the fluidtransfer device, the heat storing temperature management system 11 wouldrequire low amounts of power, e.g., less than 500 mw, and would be ableto operate for approximately 9 hours on a conventional 9 volt battery.

Heat Exhausting Temperature Management System

The temperature management system 10 also comprises a heat exhaustingtemperature management system 40 thermally coupled with the heat storingtemperature management system 11. The heat exhausting temperaturemanagement system 40 removes heat from the heat storing temperaturemanagement system 11 and transfers the heat to the environment outsidethe temperature management system 10.

In one embodiment, as illustrated in FIG. 2, the heat exhaustingtemperature management system 40 comprises a thermoelectric coolercomprising, e.g., a hot plate 46 and a cold plate 44. The heatexhausting temperature management system 40 may also comprise a multiplestage thermoelectric temperature management system. The thermoelectriccooler 40 comprises two different types of semiconductors 40′ and 40″,such as a p-type semiconductor and an n-type semiconductor,respectively, sandwiched between the cold plate 44 and the hot plate 46.In one embodiment, the cold plate 44 and the hot plate 46 may be madefrom a ceramic material. The semiconductors 40′ and 40″ are connectedelectrically in series and thermally in parallel. A power source 36provides energy for the thermoelectric cooler 40. When a positivevoltage from the power source 36 is applied to the n-type semiconductor40″, electrons pass from the low energy p-type semiconductor 40′ to thehigh energy n-type semiconductor 40″. In so doing, the electrons absorbenergy (i.e., heat). As the electrons pass from the high energy n-typesemiconductor 40″ to the low energy p-type semiconductor 40′, heat isexpelled. Thus, heat energy 48 is initially transferred from a heatsource to the cold junction, or cold plate 44. This heat is thentransferred by the semiconductors to the hot junction, or hot plate 46.The heat transferred is proportional to the current and the number ofthermoelectric couples. From the hot plate 46, the heat is transferredto the environment outside the temperature management system 10. Theheat may be transferred to the drill string 16, the annulus 52 betweenthe downhole tool 14 and the formation 17, or the drilling fluid beingpumped through the drill string 16 and the downhole tool 14. The heatmay be transferred from the hot plate 46 to the environment directlythrough conduction or indirectly through convection or radiation, or anycombination of direct and indirect transfer. As used herein, the term“thermoelectric cooler” includes both a single stage thermoelectriccooler, as well as multistage and cascade arrangements of multiplethermoelectric cooler stages.

The cold plate 44 of the heat exhausting temperature management system40 is thermally coupled with the heat sink 22 of the heat storingtemperature management system 11. The heat exhausting temperaturemanagement system 40 removes heat from the heat sink 22 at the coldplate 44 and transfers the removed heat to the hot plate 46. From thehot plate 46, the heat is then transferred to the environment outsidethe temperature management system 10. The heat may be transferred to thedrill string 16, the drilling fluid traveling in the annulus 52 betweenthe downhole tool 14 and the formation 17, or the drilling fluid beingpumped through the drill string 16 and the downhole tool 14. The heatmay be transferred from the hot plate 46 to the environment throughconduction or through convection or radiation, or any combination ofdirect and indirect transfer. The heat exhausting temperature managementsystem 40 allows removed heat to be transferred to the drilling fluideven though the drilling fluid may be at a higher temperature than thethermal component 12. The heat exhausting temperature management system40 may also comprise more than one thermoelectric cooler thermallycoupled with the heat storing temperature management system 11. Insteadof a thermoelectric cooler, alternatively the heat exhaustingtemperature management system 40 may comprise a thermoacoustic system, avapor compression system, or other suitable heat pumping device.

Power for the thermal component 12 and the thermoelectric cooler 40 maybe supplied by a turbine alternator 42, which is driven by the drillingfluid pumped through the drill string 16. The turbine alternator 16 maybe of the axial, radial, or mixed flow type. Alternatively, thealternator 42 may be driven by a positive displacement motor driven bythe drilling fluid, such as a Moineau-type motor.

If the heat exhausting temperature management system 40 is poweredprimarily by, e.g., the turbine alternator 42, it may operate duringpumping of drilling fluid through the drill string 16 and for short timeperiods with the pumps off. With the pumps on, the heat exhaustingtemperature management system 40 removes heat from the heat storingtemperature management system 11 and allows the temperature managementsystem 10 to maintain heat removal from the thermal component 12. Thereare, however, periods when drilling fluid is not pumped through thedrill string 16. During these times, the heat exhausting temperaturemanagement system 40 may not be operational, unless there is some othersource of power. However, even if the heat exhausting temperaturemanagement system 40 is not operating, the heat storing temperaturemanagement system 11 is able to remove heat from the thermal component12 and store the removed heat the heat sink 22. Once drilling fluid flowis restored, the heat exhausting temperature management system 40 willthen remove the stored removed heat from the heat sink 22. Thus, theheat storing temperature management system 11 and the heat exhaustingtemperature management system 40 combine to manage the temperature ofthe thermal component 12.

Alternatively, when the power source 36 is on, the heat exhaustingtemperature management system 40 may be operated by a control systemthat determines when the heat exhausting temperature management system40 operates. The control system is represented by the flow chart shownin FIG. 3. With reference to the flow chart shown in FIG. 3, the heatexhausting temperature management system 40 may remain in the off stateuntil the temperature of the heatsink (T_(Heatsink)), or some othermonitored component, e.g., a thermal component 12, reaches apredetermined setpoint temperature (T_(Setpoint)). Thus, even though thepower source 36 is providing power, the control system dictates whetherthe heat exhausting temperature management system 40 operates based onthe monitored criteria.

Thermal Barrier

The temperature management system 10 may alternatively further comprisea thermal barrier 50 enclosing the heat storing temperature managementsystem 11, the heat exchanger 20, and the thermal component 12. Thethermal barrier 50 thus separates the heat storing temperaturemanagement system 11, the heat exchanger 20, and the thermal component12 from the downhole environment. The thermal barrier 50 may alsoenclose only a portion of the heat storing temperature management system11. The thermal barrier 50 hinders heat transfer from the outsideenvironment to the heat storing temperature management system 11 and thethermal component 12. By way of non-limiting example, the barrier 50 maybe an insulated vacuum “flask”, a vacuum “flask” filled with aninsulating solid, a material-filled chamber, a gas-filled chamber, afluid-filled chamber, or any other suitable barrier. In addition, thespace 52 between the thermal barrier 50 and the tool 14 may beevacuated. Creating a vacuum aids in hindering heat transfer to thetemperature management system 10 and the thermal component 12.

General Closing

The temperature management system 10 removes enough heat to maintain thethermal component 12 at or below its rated temperature, which may be;e.g., no more than 125° C. For example, the temperature managementsystem 10 may maintain the component 12 at or below 100° C., or even ator below 80° C. Typically, the lower the temperature, the longer thelife of the thermal component 12.

Thus, the temperature management system 10 may not manage thetemperature of the entire cavity 15 or even the entire electronicschassis, but does manage the temperature of the thermal component 12itself. When absorbing heat from the thermal component 12, thetemperature management system 10 may allow the average temperature ofthe cavity 15 to reach a higher temperature than that at which thethermal components 12 are held. Absorbing heat from the thermalcomponent 12 thus extends the useful life of the thermal component 12,despite the average temperature of the cavity 15 being higher. Thisallows the thermal component 12 to operate a longer duration at a givenenvironment temperature for a given volume of heat sink than possible ifthe average temperature of the entire cavity 15 is managed.

Second Embodiment

Thermal Component, Heat Exchanger, and Heat Storing TemperatureManagement System

FIG. 4 illustrates a second embodiment of a temperature managementsystem 310 disposed in a downhole tool 14 such as on a drill string 16for drilling a borehole 13 in a formation 17. The temperature managementsystem 310 might also be used in a downhole wireline tool, a permanentlyinstalled downhole tool, or a temporary well testing tool. However, thetemperature management system 310 may also be used in other situationsand applications where the surrounding environment ambient temperatureis either greater than or less than that of the thermal components beingcooled.

As with the temperature management system 10, the temperature managementsystem 310 manages the temperature of a thermal component 312 mounted,e.g., on a board 318 in the downhole tool 14. The temperature managementsystem 310 also comprises a heat exchanger 320 thermally coupled withthe thermal component 312 as with the temperature management system 10.The temperature management system 310 also comprises a heat storingtemperature management system 311 thermally coupled with the heatexchanger 320 as disclosed in the temperature management system 10,including similar reference numerals for like parts. The heat storingtemperature management system 311 removes heat from the thermalcomponent 312 through the heat exchanger 320 and stores the removed heatwithin the heat storing temperature management system 311. The heatstoring temperature management system 311 also comprises a thermalconduit system 326 for thermally coupling the heat exchanger 320 and theheat sink 322.

Heat Exhausting Temperature Management System #2

The temperature management system 310 also comprises a heat exhaustingtemperature management system 340. However, in the temperaturemanagement system 310, the heat exhausting temperature management system340 is thermally coupled with a second heat exchanger 321, which isthermally coupled to the thermal component 312 in a similar manner asthe heat exchanger 320. Thus, instead of removing heat from the heatsink 322 of the heat storing temperature management system 311, the heatexhausting temperature management system 340 removes heat from thethermal component 312 through the second heat exchanger 321. The heatexhausting temperature management system 340 then transfers the removedheat to the environment outside the temperature management system 310.As before, the heat may be transferred to the drill string 16, thedrilling fluid traveling in the annulus 52 between the downhole tool 14and the formation 17, or the drilling fluid being pumped through thedrill string 16 and the downhole tool 14. The heat may be transferredfrom the hot plate to the environment directly through conduction orindirectly through convection or radiation, or any combination of directand indirect transfer. The heat exhausting temperature management system340 allows removed heat to be transferred to the drilling fluid eventhough the drilling fluid may be at a higher temperature than thethermal component 312. The heat exhausting temperature management system340 may also comprise more than one thermoelectric cooler thermallycoupled with the thermal component 312, thus comprising multiple stagesof heat exhausting temperature management. Instead of a thermoelectriccooler, alternatively the heat exhausting temperature management system340 may comprise a thermoacoustic cooler or a vapor compressiontemperature management system. The temperature management system 310 mayalso be used to cool more than one thermal component 312.

Power for the thermal component 312 and the thermoelectric cooler 340,is similarly supplied by the turbine alternator 42, a battery, orcombination thereof, which may be driven by the drilling fluid pumpedthrough the drill string 16. Because the heat exhausting temperaturemanagement system 340 is powered by the turbine alternator 42, it mayonly operate during pumping of drilling fluid through the drill string16. During that time, the heat exhausting temperature management system340 removes heat from the thermal component 312 and allows thetemperature management system 310 to maintain heat removal from thethermal component 312. There are, however, periods when drilling fluidis not pumped through the drill string 16. During these times, the heatexhausting temperature management system 340 may not be operational,unless there is some amount of battery power. However, when the heatexhausting temperature management system 340 is not operating, the heatstoring temperature management system 311 is still able to remove heatfrom the thermal component 312 and store the removed heat the heat sink322. Once drilling fluid flow is restored, the heat exhaustingtemperature management system 340 will then be able to begin removingheat from the thermal component 312. Thus, the heat storing temperaturemanagement system 311 and the heat exhausting temperature managementsystem 340 combine to manage the temperature of the thermal component312.

Alternatively, when the power source 36 is on, the heat exhaustingtemperature management system 340 may be operated by a control systemthat determines when the heat exhausting temperature management system340 operates. The control system is similar to the control systemdescribed above and represented by the flow chart shown in FIG. 3.

Thermal Barrier

The temperature management system 310 may also alternatively comprise athermal barrier 350 enclosing the temperature management system 310. Thethermal barrier 350 may also enclose only a portion of the temperaturemanagement system 310. The thermal barrier 350 hinders heat transferfrom the outside environment to the temperature management system 310and the thermal component 312.

General Closing

The temperature management system 310 removes enough heat to maintainthe thermal component 312 at or below its rated temperature, which maybe; e.g., no more than 125° C. For example, the temperature managementsystem 310 may maintain the component 312 at or below 100° C., or evenat or below 80° C. Typically, the lower the temperature, the longer thelife of the thermal component 312.

Thus, the temperature management system 310 may not manage thetemperature of the entire cavity 315 or even the entire electronicschassis, but does manage the temperature of the thermal component 312itself. When absorbing heat from the thermal component 312, thetemperature management system 310 may allow the average temperature ofthe cavity 315 to reach a higher temperature than that at which thethermal components 312 are held. Absorbing heat from the thermalcomponents 312 thus extends the useful life of the thermal component312, despite the average temperature of the cavity 315 being higher.This allows the thermal component 312 to operate a longer duration at agiven environment temperature for a given volume of heat sink thanpossible if the average temperature of the entire cavity 315 is managed.

Third Embodiment

Thermal Component, Heat Exchanger, and Heat Storing TemperatureManagement System

FIG. 5 illustrates a third embodiment of a temperature management system410 disposed in a downhole tool 14 such as on a drill string 16 fordrilling a borehole 13 in a formation 17. The temperature managementsystem 410 might also be used in a downhole wireline tool, a permanentlyinstalled downhole tool, or a temporary well testing tool. However, thetemperature management system 410 may also be used in other situationsand applications where the surrounding environment ambient temperatureis either greater than or less than that of the thermal components beingcooled.

As with the temperature management system 10, the temperature managementsystem 410 manages the temperature of one or more thermal components 412mounted on one or more boards 418 in the downhole tool 14. Thetemperature management system 410 also comprises a heat exchanger 420thermally coupled with the thermal component 412 as with the temperaturemanagement system 10. The temperature management system 410 alsocomprises a heat storing temperature management system 411 thermallycoupled with the heat exchanger 420 as disclosed in the temperaturemanagement system 10, including similar reference numerals for likeparts. The heat storing temperature management system 411 removes heatfrom the thermal component 412 through the heat exchanger 420 and storesthe removed heat in within the heat storing temperature managementsystem 411. The heat storing temperature management system 411 alsocomprises a thermal conduit system 426 for thermally coupling the heatexchanger 420 and the heat sink 422.

Heat Exhausting Temperature Management System #3

The temperature management system 410 also comprises a heat exhaustingtemperature management system 440. However, in the temperaturemanagement system 410, the heat exhausting temperature management system440 is thermally coupled with the heat exchanger 420, not the heat sink422. Thus, instead of removing heat from the heat sink 422 of the heatstoring temperature management system 411, the heat exhaustingtemperature management system 440 removes heat from the heat exchanger420. The heat exhausting temperature management system 440 thentransfers the removed heat to the environment outside the temperaturemanagement system 410. As before, the heat may be transferred to thedrill string 16, the drilling fluid traveling in the annulus 52 betweenthe downhole tool 14 and the formation 17, or the drilling fluid beingpumped through the drill string 16 and the downhole tool 14. The heatmay be transferred from the hot plate to the environment directlythrough conduction or indirectly through convection or radiation, or anycombination of direct and indirect transfer. The heat exhaustingtemperature management system 440 allows removed heat to be transferredto the drilling fluid even though the drilling fluid may be at a highertemperature than the thermal component 412. The heat exhaustingtemperature management system 440 may also comprise more than onethermoelectric cooler thermally coupled with the thermal component 412,thus comprising multiple stages of heat exhausting temperaturemanagement. Instead of a thermoelectric cooler, alternatively the heatexhausting temperature management system 440 may comprise athermoacoustic cooler or a vapor compression temperature managementsystem. The temperature management system 410 may also be used to coolmore than one thermal component 412.

Power for the thermal component 412 and the thermoelectric cooler 440may be similarly supplied by the turbine alternator 42, which may bedriven by the drilling fluid pumped through the drill string 16. If theheat exhausting temperature management system 440 is powered by theturbine alternator 42, it may only operate during pumping of drillingfluid through the drill string 16. During that time, the heat exhaustingtemperature management system 440 removes heat from the thermalcomponent 412 through the heat exchanger 420 and allows the temperaturemanagement system 410 to maintain heat removal from the thermalcomponent 412. There are, however, periods when drilling fluid is notpumped through the drill string 16. During these times, the heatexhausting temperature management system 440 may not be operational,unless there is some amount of battery power. However, when the heatexhausting temperature management system 440 is not operating, the heatstoring temperature management system 411 is still able to remove heatfrom the thermal component 412 and store the removed heat the heat sink422. Once drilling fluid flow is restored, the heat exhaustingtemperature management system 440 will then be able to begin removingheat from the thermal component 412. Thus, the heat storing temperaturemanagement system 411 and the heat exhausting temperature managementsystem 440 combine to manage the temperature of the thermal component412.

Alternatively, when the power source 36 is on, the heat exhaustingtemperature management system 440 may be operated by a control systemthat determines when the heat exhausting temperature management system440 operates. The control system is similar to the control systemdescribed above and represented by the flow chart shown in FIG. 3.

Thermal Barrier

The temperature management system 410 may also alternatively comprise athermal barrier 450 enclosing the temperature management system 410. Thethermal barrier 450 may also enclose only a portion of the temperaturemanagement system 410. The thermal barrier 450 hinders heat transferfrom the outside environment to the temperature management system 410and the thermal component 412.

General Closing

The temperature management system 410 removes enough heat to maintainthe thermal component 412 at or below its rated temperature, which maybe; e.g., no more than 125° C. For example, the temperature managementsystem 410 may maintain the component 412 at or below 100° C., or evenat or below 80° C. Typically, the lower the temperature, the longer thelife of the thermal component 412.

Thus, the temperature management system 410 may not manage thetemperature of the entire cavity 415 or even the entire electronicschassis, but does manage the temperature of the thermal component 412itself. When absorbing heat from the thermal component 412, thetemperature management system 410 may allow the average temperature ofthe cavity 415 to reach a higher temperature than that at which thethermal components 412 are held. Absorbing heat from the thermalcomponent 412 thus extends the useful life of the thermal component 412,despite the average temperature of the cavity 415 being higher. Thisallows the thermal component 412 to operate a longer duration at a givenenvironment temperature for a given volume of heat sink than possible ifthe average temperature of the entire cavity 415 is managed.

Fourth Embodiment

Thermal Component, Heat Exchanger, and Heat Storing TemperatureManagement System

FIG. 6 illustrates a fourth embodiment of a temperature managementsystem 510 disposed in a downhole tool 14 such as on a drill string 16for drilling a borehole 13 in a formation 17. The temperature managementsystem 510 might also be used in a downhole wireline tool, a permanentlyinstalled downhole tool, or a temporary well testing tool. However, thetemperature management system 510 may also be used in other situationsand applications where the surrounding environment ambient temperatureis either greater than or less than that of the thermal components beingcooled.

As with the temperature management system 10, the temperature managementsystem 510 manages the temperature of one or more thermal components 512mounted on one or more boards 518 in the downhole tool 14. Thetemperature management system 510 also comprises a heat exchanger 520thermally coupled with the thermal component 512 as with the temperaturemanagement system 10. The temperature management system 510 alsocomprises a heat storing temperature management system 511 thermallycoupled with the heat exchanger 520 as disclosed in the temperaturemanagement system 10, including similar reference numerals for likeparts. The heat storing temperature management system 511 removes heatfrom the thermal component 512 through the heat exchanger 520 and storesthe removed heat in within the heat storing temperature managementsystem 511. The heat storing temperature management system 511 alsocomprises a thermal conduit system 526 for thermally coupling the heatexchanger 520 and the heat sink 522.

Heat Exhausting Temperature Management System #4

The temperature management system 510 also comprises a heat exhaustingtemperature management system 540. However, in the temperaturemanagement system 510, the heat exhausting temperature management system540 is thermally coupled with the thermal conduit system 526, not theheat sink 522. Thus, instead of removing heat from the heat sink 522 ofthe heat storing temperature management system 511, the heat exhaustingtemperature management system 540 removes heat from the thermal conduit526. The heat exhausting temperature management system 540 thentransfers the removed heat to the environment outside the temperaturemanagement system 510. As before, the heat may be transferred to thedrill string 16, the drilling fluid traveling in the annulus 52 betweenthe downhole tool 14 and the formation 17, or the drilling fluid beingpumped through the drill string 16 and the downhole tool 14. The heatmay be transferred from the hot plate to the environment directlythrough conduction or indirectly through convection or radiation, or anycombination of direct and indirect transfer. The heat exhaustingtemperature management system 540 allows removed heat to be transferredto the drilling fluid even though the drilling fluid may be at a highertemperature than the thermal component 512. The heat exhaustingtemperature management system 540 may also comprise more than onethermoelectric cooler thermally coupled with the thermal component 512,thus comprising multiple stages of heat exhausting temperaturemanagement. Instead of a thermoelectric cooler, alternatively the heatexhausting temperature management system 540 may comprise athermoacoustic cooler or a vapor compression temperature managementsystem. The temperature management system 510 may also be used to coolmore than one thermal component 512.

Power for the thermal component 512 and the thermoelectric cooler 540,may similarly be supplied by the turbine alternator 42, which may bedriven by the drilling fluid pumped through the drill string 16. Becausethe heat exhausting temperature management system 540 is powered by theturbine alternator 42, it may only operate during pumping of drillingfluid through the drill string 16. During that time, the heat exhaustingtemperature management system 540 removes heat from the thermalcomponent 512 through the thermal conduit 526 and allows the temperaturemanagement system 510 to maintain heat removal from the thermalcomponent 512. There are, however, periods when drilling fluid is notpumped through the drill string 16. During these times, the heatexhausting temperature management system 540 may not be operational,unless there is some amount of battery power. However, when the heatexhausting temperature management system 540 is not operating, the heatstoring temperature management system 511 is still able to remove heatfrom the thermal component 512 and store the removed heat the heat sink522. Once drilling fluid flow is restored, the heat exhaustingtemperature management system 540 will then be able to begin removingheat from the thermal component 512. Thus, the heat storing temperaturemanagement system 511 and the heat exhausting temperature managementsystem 540 combine to manage the temperature of the thermal component512.

Alternatively, when the power source 36 is on, the heat exhaustingtemperature management system 540 may be operated by a control systemthat determines when the heat exhausting temperature management system540 operates. The control system is similar to the control systemdescribed above and represented by the flow chart shown in FIG. 3.

Thermal Barrier

The temperature management system 510 may also alternatively comprise athermal barrier 550 enclosing the temperature management system 510. Thethermal barrier 550 may also enclose only a portion of the temperaturemanagement system 510. The thermal barrier 550 hinders heat transferfrom the outside environment to the temperature management system 510and the thermal component 512.

General Closing

The temperature management system 510 removes enough heat to maintainthe thermal component 512 at or below its rated temperature, which maybe; e.g., no more than 125° C. For example, the temperature managementsystem 510 may maintain the component 512 at or below 100° C., or evenat or below 80° C. Typically, the lower the temperature, the longer thelife of the thermal component 512.

Thus, the temperature management system 510 may not manage thetemperature of the entire cavity 515 or even the entire electronicschassis, but does manage the temperature of the thermal component 512itself. When absorbing heat from the thermal component 512, thetemperature management system 510 may allow the average temperature ofthe cavity 515 to reach a higher temperature than that at which thethermal components 512 are held. Absorbing heat from the thermalcomponent 512 thus extends the useful life of the thermal component 512,despite the average temperature of the cavity 515 being higher. Thisallows the thermal component 512 to operate a longer duration at a givenenvironment temperature for a given volume of heat sink than possible ifthe average temperature of the entire cavity 515 is managed.

While specific embodiments have been shown and described, modificationscan be made by one skilled in the art without departing from the spiritor teaching of this invention. The embodiments as described areexemplary only and are not limiting. Many variations and modificationsare possible and are within the scope of the invention. Accordingly, thescope of protection is not limited to the embodiments described, but isonly limited by the claims that follow, the scope of which shall includeall equivalents of the subject matter of the claims.

1. A system for the temperature management of a thermal component: aheat exchanger thermally coupled with the thermal component; a heatstoring temperature management system thermally coupled with said heatexchanger; and a heat exhausting temperature management system thermallycoupled with said heat storing temperature management system.
 2. Thesystem of claim 1 wherein said heat exchanger is selected from the groupconsisting of a micro-capillary, cold plate heat exchanger; a conductionheat exchanger; a multiple layer heat exchanger; a micro-channel, coldplate heat exchanger; and a liquid cold plate heat exchanger.
 3. Thesystem of claim 1 wherein said system and the thermal component are in atool selected from the group consisting of a downhole drill string tool,a downhole wireline tool, a permanently installed downhole tool, and atemporary well testing tool.
 4. The system of claim 1 wherein saidsystem is at least partially contained within a thermal barrier.
 5. Thesystem of claim 1 wherein said heat storing temperature managementsystem removes heat from the thermal component and stores the heatwithin said heat storing temperature management system.
 6. The system ofclaim 5 wherein said heat exhausting temperature management systemtransfers heat from said heat storing temperature management system tothe environment outside the system.
 7. The system of claim 6 wherein:said temperature management system is located within a downhole tool ona drill string; and said exhausting temperature management systemtransfers heat to drilling fluid being pumped through the drill stringand the downhole tool.
 8. The system of claim 1 wherein said heatstoring temperature management system comprises: a heat sink; and athermal conduit system thermally coupling said heat exchanger with saidheat sink.
 9. The system of claim 8 wherein said thermal conduit systemthermally couples said heat exchanger with said heat sink via at leastone of conduction, convection, and radiation.
 10. The system of claim 8wherein said heat sink comprises a phase change material.
 11. The systemof claim 10 wherein said phase change material comprises a eutecticmaterial.
 12. The system of claim 8 wherein said thermal conduit systemcomprises a thermally conductive material.
 13. The system of claim 12wherein the thermal component is immersed in a fluid.
 14. The system ofclaim 8 wherein said thermal conduit system comprises a coolant fluidconduit system for the flow of a coolant fluid.
 15. The system of claim14 wherein the thermal component is immersed in a fluid.
 16. The systemof claim 14 wherein the thermal component is immersed is said coolantfluid.
 17. The system of claim 8 wherein said heat storing temperaturemanagement system transfers heat from the thermal component to said heatsink.
 18. The system of claim 8 further comprising a control system thatoperates said heat exhausting temperature management system when thetemperature of said heat sink is equal to or greater than apredetermined threshold.
 19. The system of claim 1 wherein said heatexhausting temperature management system comprises a thermoelectriccooler comprising a hot plate and a cold plate.
 20. The system of claim19 wherein said heat exhausting temperature management system comprisesa multiple stage thermoelectric temperature management system.
 21. Thesystem of claim 1 wherein said heat exhausting temperature managementsystem is selected from the group consisting of a thermoacoustic coolerand a vapor compression temperature management system.
 22. The system ofclaim 1 further comprising a control system that operates said heatexhausting temperature management system when the temperature of thethermal component is equal to or greater than a predetermined threshold.23. A system for managing the temperature of a thermal componentcomprising: a first heat exchanger thermally coupled with the thermalcomponent; a heat storing temperature management system thermallycoupled with said first heat exchanger; a second heat exchangerthermally coupled with the thermal component; and a heat exhaustingtemperature management system thermally coupled with said second heatexchanger.
 24. The system of claim 23 wherein said first and second heatexchangers are selected from the group consisting of a micro-capillary,cold plate heat exchanger; a conduction heat exchanger; a multiple layerheat exchanger; a micro-channel, cold plate heat exchanger; and a liquidcold plate heat exchanger.
 25. The system of claim 23 wherein the systemand the thermal component are in a tool selected from the groupconsisting of a downhole drill string tool, a downhole wireline tool, apermanently installed downhole tool, and a temporary well testing tool.26. The system of claim 23 wherein the system is at least partiallycontained within a thermal barrier.
 27. The system of claim 23 whereinsaid heat storing temperature management system removes heat from thethermal component and stores the heat within said heat storingtemperature management system.
 28. The system of claim 27 wherein saidheat exhausting temperature management system transfers heat from thethermal component to the environment outside the system.
 29. The systemof claim 28 wherein: said system is located within a downhole tool on adrill string; and said exhausting temperature management systemtransfers heat to drilling fluid being pumped through the drill stringand the downhole tool.
 30. The system of claim 23 wherein said heatstoring temperature management system comprises: a heat sink; and athermal conduit system thermally coupling said first heat exchanger withsaid heat sink.
 31. The system of claim 30 wherein said thermal conduitsystem thermally couples said first heat exchanger with said heat sinkvia at least one of conduction, convection, and radiation.
 32. Thesystem of claim 30 wherein said heat sink comprises a phase changematerial.
 33. The system of claim 32 wherein said phase change materialcomprises a eutectic material.
 34. The system of claim 30 wherein saidthermal conduit system comprises a thermally conductive material. 35.The system of claim 34 wherein the thermal component is immersed in afluid.
 36. The system of claim 30 wherein said thermal conduit systemcomprises a coolant fluid conduit system for the flow of a coolantfluid.
 37. The system of claim 36 wherein the thermal component isimmersed in a fluid.
 38. The system of claim 36 wherein the thermalcomponent is immersed is said coolant fluid.
 39. The system of claim 30wherein said heat storing temperature management system transfers heatfrom the thermal component to said heat sink.
 40. The system of claim 30further comprising a control system that operates said heat exhaustingtemperature management system when the temperature of said heat sink isequal to or greater than a predetermined threshold.
 41. The system ofclaim 23 wherein said heat exhausting temperature management systemcomprises a thermoelectric cooler comprising a hot plate and a coldplate.
 42. The system of claim 41 wherein said heat exhaustingtemperature management system comprises a multiple stage thermoelectrictemperature management system.
 43. The system of claim 23 wherein saidheat exhausting temperature management system is selected from the groupconsisting of a thermoacoustic cooler and a vapor compressiontemperature management system.
 44. The system of claim 23 furthercomprising a control system that operates said heat exhaustingtemperature management system when the temperature of the thermalcomponent is equal to or greater than a predetermined threshold.
 45. Asystem for managing the temperature of a thermal component comprising: aheat exchanger thermally coupled with the thermal component; a heatstoring temperature management system thermally coupled with said firstheat exchanger; and a heat exhausting temperature management systemthermally coupled with said heat exchanger.
 46. The system of claim 45wherein said heat exchanger is selected from the group consisting of amicro-capillary, cold plate heat exchanger; a conduction heat exchanger;a multiple layer heat exchanger; a micro-channel, cold plate heatexchanger; and a liquid cold plate heat exchanger.
 47. The system ofclaim 45 wherein the system and the thermal component are in a toolselected from the group consisting of a downhole drill string tool, adownhole wireline tool, a permanently installed downhole tool, and atemporary well testing tool.
 48. The system of claim 45 wherein thesystem is at least partially contained within a thermal barrier.
 49. Thesystem of claim 45 wherein said heat storing temperature managementsystem removes heat from the thermal component and stores the heatwithin said heat storing temperature management system.
 50. The systemof claim 49 wherein said heat exhausting temperature management systemtransfers heat from the thermal component to the environment outside thetemperature management system.
 51. The system of claim 50 wherein: saidsystem is located within a downhole tool on a drill string; and saidexhausting temperature management system transfers heat to drillingfluid being pumped through the drill string and the downhole tool. 52.The system of claim 45 wherein said heat storing temperature managementsystem comprises: a heat sink; and a thermal conduit system thermallycoupling said heat exchanger with said heat sink.
 53. The system ofclaim 52 wherein said thermal conduit system thermally couples said heatexchanger with said heat sink via at least one of conduction,convection, and radiation.
 54. The system of claim 52 wherein said heatsink comprises a phase change material.
 55. The system of claim 54wherein said phase change material comprises a eutectic material. 56.The system of claim 52 wherein said thermal conduit system comprises athermally conductive material.
 57. The system of claim 56 wherein thethermal component is immersed in a fluid.
 58. The system of claim 52wherein said thermal conduit system comprises a coolant fluid conduitsystem for the flow of a coolant fluid.
 59. The system of claim 58wherein the thermal component is immersed in a fluid.
 60. The system ofclaim 58 wherein the thermal component is immersed is said coolantfluid.
 61. The system of claim 52 wherein said heat storing temperaturemanagement system transfers heat from the thermal component to said heatsink.
 62. The system of claim 52 further comprising a control systemthat operates said heat exhausting temperature management system whenthe temperature of said heat sink is equal to or greater than apredetermined threshold.
 63. The system of claim 45 wherein said heatexhausting temperature management system comprises a multiple stagethermoelectric temperature management system.
 64. The system of claim 63wherein said heat exhausting temperature management system comprises athermoelectric temperature management system.
 65. The system of claim 45wherein said heat exhausting temperature management system is selectedfrom the group consisting of a thermoacoustic cooler and a vaporcompression temperature management system.
 66. The system of claim 45further comprising a control system that operates said heat exhaustingtemperature management system when the temperature of the thermalcomponent is equal to or greater than a predetermined threshold.
 67. Asystem for managing the temperature of a thermal component comprising: afirst heat exchanger thermally coupled with the thermal component; aheat storing temperature management system thermally coupled with saidfirst heat exchanger; said heat storing temperature management systemcomprising a thermal conduit system; and a heat exhausting temperaturemanagement system thermally coupled with said thermal conduit system.68. The system of claim 67 wherein said heat exchanger is selected fromthe group consisting of a micro-capillary, cold plate heat exchanger; aconduction heat exchanger; a multiple layer heat exchanger; amicro-channel, cold plate heat exchanger; and a liquid cold plate heatexchanger.
 69. The system of claim 67 wherein said system and thethermal component are in a tool selected from the group consisting of adownhole drill string tool, a downhole wireline tool, a permanentlyinstalled downhole tool, and a temporary well testing tool.
 70. Thesystem of claim 67 wherein said system is at least partially containedwithin a thermal barrier.
 71. The system of claim 67 wherein said heatstoring temperature management system removes heat from the thermalcomponent and stores the heat within said heat storing temperaturemanagement system.
 72. The system of claim 74 wherein said heatexhausting temperature management system transfers heat from saidthermal conduit system to the environment outside the temperaturemanagement system.
 73. The system of claim 72 wherein: said system islocated within a downhole tool on a drill string; and said exhaustingtemperature management system transfers heat to drilling fluid beingpumped through the drill string and the downhole tool.
 74. The system ofclaim 72 wherein said heat exhausting temperature management system isthermally coupled with said heat exchanger.
 75. The system of claim 67wherein said heat storing temperature management system comprises a heatsink thermally coupled with said heat exchanger through said thermalconduit system.
 76. The system of claim 75 wherein said thermal conduitsystem thermally couples said heat exchanger with said heat sink via atleast one of conduction, convection, and radiation.
 77. The system ofclaim 75 wherein said heat sink comprises a phase change material. 78.The system of claim 77 wherein said phase change material comprises aeutectic material.
 79. The system of claim 78 wherein said thermalconduit system comprises a thermally conductive material.
 80. The systemof claim 79 wherein the thermal component is immersed in a fluid. 81.The system of claim 75 wherein said thermal conduit system comprises acoolant fluid conduit system for the flow of a coolant fluid.
 82. Thesystem of claim 81 wherein the thermal component is immersed in a fluid.83. The system of claim 81 wherein the thermal component is immersed issaid coolant fluid.
 84. The system of claim 75 wherein said heat storingtemperature management system transfers heat from the thermal componentto said heat sink.
 85. The system of claim 75 further comprising acontrol system that operates said heat exhausting temperature managementsystem when the temperature of said heat sink is equal to or greaterthan a predetermined threshold.
 86. The system of claim 67 wherein saidheat exhausting temperature management system comprises a thermoelectriccooler comprising a hot plate and a cold plate.
 87. The system of claim86 wherein said heat exhausting temperature management system comprisesa multiple stage thermoelectric temperature management system.
 88. Thesystem of claim 67 wherein said heat exhausting temperature managementsystem is selected from the group consisting of a thermoacoustic coolerand a vapor compression temperature management system.
 89. The system ofclaim 67 further comprising a control system that operates said heatexhausting temperature management system when the temperature of thethermal component is equal to or greater than a predetermined threshold.90. A method of managing the temperature of a thermal componentcomprising: removing heat from the thermal component with a heatexhausting temperature management system; powering said heat exhaustingtemperature management system with a power source; and removing heatfrom the thermal component with a heat storing temperature managementsystem at least when said power source is not operating.
 91. The methodof claim 90 further comprising removing heat from a thermal component ina tool selected from the group consisting of a downhole drill stringtool, a downhole wireline tool, a permanently installed downhole tool,and a temporary well testing tool.
 92. The method of claim 90 whereinremoving heat with said heat storing temperature management systemcomprises: thermally coupling said heat storing temperature managementsystem to the thermal component using a heat exchanger; removing heatfrom the thermal component through the heat exchanger with said heatstoring temperature management system; and storing the heat removed bysaid heat storing temperature management system in a heat sink withinsaid heat storing temperature management system.
 93. The method of claim90 wherein removing heat with said heat exhausting temperaturemanagement system comprises: thermally coupling said heat exhaustingtemperature management system with said heat storing temperaturemanagement system; removing heat from said heat storing temperaturemanagement system with said heat exhausting temperature managementsystem; and storing the heat removed by said heat exhausting temperaturemanagement system to the environment outside the temperature managementsystem.
 94. The system of claim 93 wherein transferring the heat removedby said heat exhausting temperature management system comprisestransferring heat to drilling fluid being pumped through a drill stringand a downhole tool.
 95. The method of claim 93 wherein removing heatfrom said heat storing temperature management system comprises:thermally coupling said heat exhausting temperature management system tosaid heat sink; and removing heat from said heat sink.
 96. The method ofclaim 93 wherein removing heat from said heat storing temperaturemanagement system comprises: thermally coupling said heat exhaustingtemperature management system to a thermal conduit system of said heatstoring temperature management system; and removing heat from saidthermal conduit system.
 97. The method of claim 90 wherein removing heatfrom the thermal component with a heat exhausting temperature managementsystem comprises: thermally coupling said heat exhausting temperaturemanagement system to the thermal component; removing heat from thethermal component with said heat exhausting temperature managementsystem; and transferring the heat removed by said heat exhaustingtemperature management system to the environment outside the temperaturemanagement system.
 98. The system of claim 97 wherein transferring theheat removed by said heat exhausting temperature management systemcomprises transferring heat to drilling fluid being pumped through adrill string and a downhole tool.
 99. The method of claim 90 furthercomprising thermally coupling said heat exhausting temperaturemanagement system to the thermal component with a second heat exchanger.100. The method of claim 90 wherein removing heat from the thermalcomponent with said heat exhausting temperature management systemfurther comprises removing heat with at least one of a thermoelectriccooler, a thermoacoustic cooler, and a vapor compression temperaturemanagement system.
 101. The method of claim 90 further comprisingretarding heat flow to the thermal component with a thermal barrier.102. The method of claim 90 wherein the thermal component is in anenvironment with a higher temperature than the thermal component. 103.The method of claim 90 further comprising operating said heat exhaustingtemperature management system with a control system that operates saidheat exhausting temperature management system when the temperature ofthe thermal component is equal to or greater than a predeterminedthreshold.
 104. The method of claim 90 further comprising: storing theheat removed by said heat storing temperature management system in aheat sink within said heat storing temperature management system; andoperating said heat exhausting temperature management system with acontrol system that operates said heat exhausting temperature managementsystem when the temperature of said heat sink is equal to or greaterthan a predetermined threshold.